Effect of 260/spl deg/C reflow on the ability of mold compounds to meet moisture sensitivity level one (MSL1)-Reference-Cited by-同舟云学术

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Effect of 260/spl deg/C reflow on the ability of mold compounds to meet moisture sensitivity level one (MSL1)

Published:2005-12 Issue:4 Volume:28 Page:841-851
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Fauty J.,Cada L.G.,Stana M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/32999/01546197.pdf?arnumber=1546197

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interface delamination analysis of TQFP package during solder reflow;Microelectronics Reliability;2010-07

2. Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages;Moisture Sensitivity of Plastic Packages of IC Devices;2010

3. Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices;Moisture Sensitivity of Plastic Packages of IC Devices;2010

4. Influence of Nonuniform Initial Porosity Distribution on Adhesive Failure in Electronic Packages;IEEE Transactions on Components and Packaging Technologies;2008-06

5. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning;IEEE Transactions on Components and Packaging Technologies;2008-06

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