Process-Dependent Contact Characteristics of NCA Assemblies-Reference-Cited by-同舟云学术

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Process-Dependent Contact Characteristics of NCA Assemblies

Published:2004-06 Issue:2 Volume:27 Page:398-410
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:en
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Cheng H.-C.,Ho C.-L.,Chiang K.-N.,Chang S.-M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/29036/01308462.pdf?arnumber=1308462

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding;Journal of Materials Science: Materials in Electronics;2016-03-07

2. Thermal Stress–Induced Interfacial Failure Modes of Advanced Electronic Devices;Encyclopedia of Thermal Stresses;2014

3. Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA);Current Applied Physics;2013-07

4. Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA;Microelectronics Reliability;2011-04

5. Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives;Microelectronics Reliability;2011-04

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