Thermal Stress–Induced Interfacial Failure Modes of Advanced Electronic Devices-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Thermal Stress–Induced Interfacial Failure Modes of Advanced Electronic Devices

Published:2014 Issue: Volume: Page:5495-5495
ISSN:
Container-title:Encyclopedia of Thermal Stresses
language:
Short-container-title:

Author:

Lee Chang-Chun,Chiang Kuo-Ning

Publisher

Springer Netherlands

Link

http://link.springer.com/content/pdf/10.1007/978-94-007-2739-7_267

Reference64 articles.

1. Lee ZM (1999) Liquid encapsulant technology and its development. Ind Mater 151:117–131

2. Lau JH (1995) Ball grid array technology. McGraw-Hill, New York

3. Lau JH, Lee SWR (1999) Chip scale package (CSP). McGraw-Hill, New York

4. Lau JH (1995) Flip chip technologies. McGraw-Hill, New York

5. Lau JH (2000) Low cost flip chip technologies. McGraw-Hill, New York

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP