A New Approach in Measuring Cu–EMC Adhesion Strength by AFM-Reference-Cited by-同舟云学术

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A New Approach in Measuring Cu–EMC Adhesion Strength by AFM

Published:2006-09 Issue:3 Volume:29 Page:543-550
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Wong C.K.Y.,Gu H.,Xu B.,Yuen M.M.F.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/35464/01684177.pdf?arnumber=1684177

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

3. Characterization of metal‐polymer interaction forces by AFM for insert molding applications;Polymer Engineering & Science;2020-10-23

4. Characterization of encapsulant properties;Encapsulation Technologies for Electronic Applications;2019

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