Transfer of metal MEMS packages using a wafer-level solder transfer technique
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/6040/32646/01528648.pdf?arnumber=1528648
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2. Solid-Liquid Interdiffusion Bonding between Ti/Ni/Ag/Sn Backside Metallized Si Chips and Cu/Al2O3 - DBC Substrates with Au/Pd/Ni Surface Finish;International Journal of Mining, Materials, and Metallurgical Engineering;2022
3. Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing;Advanced MEMS/NEMS Fabrication and Sensors;2021-10-13
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5. Metallic alloy seal bonding;Handbook of Silicon Based MEMS Materials and Technologies;2020
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