Wafer-level vacuum sealing for packaging of silicon photonic MEMS-Reference-Cited by-同舟云学术

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Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Published:2021-03-05 Issue: Volume: Page:
ISSN:
Container-title:Silicon Photonics XVI
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Author:

Jo Gaehun,Edinger Pierre,Bleiker Simon,Wang Xiaojing,Takabayashi Alain Y.,Sattari Hamed,Quack Niels,Jezzini de Anda Moises A.,Verheyen Peter,Stemme Göran,Bogaerts Wim,Gylfason Kristinn B.,Niklaus Frank

Publisher

SPIE

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement of chemical mechanical polishing performance by introducing N–Si bond via external coating of cerium oxide with ZIF-8;Surfaces and Interfaces;2024-07

2. Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging;Microelectronic Engineering;2024-03

3. Low-power actuators for programmable photonic processors;AI and Optical Data Sciences IV;2023-03-15

4. Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging;2023

5. MORPHIC: MEMS enhanced silicon photonics for programmable photonics;Integrated Photonics Platforms II;2022-05-26

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