Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method-Reference-Cited by-同舟云学术

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Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method

Published:2009-11 Issue:4 Volume:32 Page:729-739
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Jin Yang ,Ume I.C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/5286959/05276809.pdf?arnumber=5276809

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu 7 In 3;Materials Chemistry and Physics;2016-05

2. Embedded resistors in printed circuit board assembly;2013 8TH INTERNATIONAL SYMPOSIUM ON ADVANCED TOPICS IN ELECTRICAL ENGINEERING (ATEE);2013-05

3. Fabrication of integrated resistors in printed circuit boards;Journal of Central South University;2011-06

4. Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System;Journal of Electronic Packaging;2010-06-01

5. Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods;IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control;2010-04

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