Author:
Zhang Xiaowu,Wong E. H.,Rajoo Ranjan,Iyer Mahadevan K.,Caers J. F. J. M.,Zhao X. J.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
1 articles.
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1. Design and verification of modular and reusable aging test system for high power SIP;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10