Cost and Performance Tradeoff Analysis in Radio and Mixed-Signal System-on-Package Design-Reference-Cited by-同舟云学术

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Cost and Performance Tradeoff Analysis in Radio and Mixed-Signal System-on-Package Design

Published:2004-05 Issue:2 Volume:27 Page:364-375
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Zheng L.-R.,Duo X.,Shen M.,Michielsen W.,Tenhunen H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/29406/01331518.pdf?arnumber=1331518

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on Photovoltaic Amplifier Circuit based on Filter Module;2022 2nd International Conference on Electrical Engineering and Control Science (IC2ECS);2022-12-16

2. Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design;Lecture Notes in Electrical Engineering;2020

3. Organically Packaged Components and Modules: Recent Advancements for Microwave and mm-Wave Applications;IEEE Microwave Magazine;2019-11

4. State-of-the-Art Approach: System-on-Package;Smart Sensors, Measurement and Instrumentation;2019

5. High-Fidelity, High-Performance Computational Algorithms for Intrasystem Electromagnetic Interference Analysis of IC and Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-05

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