Author:
Bernstein G.H.,Qing Liu ,Minjun Yan ,Zhuowen Sun ,Kopp D.,Porod W.,Snider G.,Fay P.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
23 articles.
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1. Reduction of Data Leakage Trojans in Modulation Scheme of TDMA using Encoding and Decoding;2023 3rd International Conference on Emerging Frontiers in Electrical and Electronic Technologies (ICEFEET);2023-12-21
2. Pb-free solder contact reliability at extreme condition and in phase transition;2023 IEEE 68th Holm Conference on Electrical Contacts (HOLM);2023-10-04
3. The Smart Development of Multichip Communication Systems with The Help of Short Transmission Nodes;2023 International Conference on Distributed Computing and Electrical Circuits and Electronics (ICDCECE);2023-04-29
4. Computational study for electronic interconnects and performance of solders and solder paste;2021 IEEE 66th Holm Conference on Electrical Contacts (HLM);2021-10-24
5. Quantifying the Impact of Monolithic 3D (M3D) Integration on L1 Caches;IEEE Transactions on Emerging Topics in Computing;2021-04-01