The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications-Reference-Cited by-同舟云学术

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The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications

Published:2017-12 Issue: Volume: Page:
ISSN:
Container-title:2017 Eleventh International Conference on Sensing Technology (ICST)
language:
Short-container-title:

Author:

Ngo Ha-Duong¹,Mackowiack Piotr¹,Grabbert Niels¹,Weiland Thomas¹,Hu Xiaodong²,Schneider-Ramelow Martin¹,Ehrmann Oswin¹,Lang Klaus-Dieter¹

Affiliation:

1. Fraunhofer Institute IZM, Berlin, Germany

2. Technical University Berlin, Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8301141/8304414/08304457.pdf?arnumber=8304457

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Direct and Flexible Temperature Measurement and Thermal Compensation methods for Piezoresistive Pressure Sensor;2023 5th International Academic Exchange Conference on Science and Technology Innovation (IAECST);2023-12-08

2. An SOI-Structured Piezoresistive Differential Pressure Sensor with High Performance;Micromachines;2022-12-17

3. Pressure Sensor Devices Featuring a Chemical Passivation Made of a Locally Synthesized Diamond Layer;physica status solidi (a);2022-10-27

4. Sensor applications based on AlGaN/GaN heterostructures;Materials Science and Engineering: B;2021-01

5. Miniaturized Flexible Piezoresistive Pressure Sensors: Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Copolymers Blended with Graphene Oxide for Biomedical Applications;ACS Applied Materials & Interfaces;2019-08-27

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