Investigation and Review of Challenges in a High-Temperature 30-kVA Three-Phase Inverter Using SiC MOSFETs

Author:

Qi FengORCID,Wang Miao,Xu Longya

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering

Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Mitigating Partial Discharge Caused by Steep Voltage Pulses at High Temperatures;IEEE Transactions on Dielectrics and Electrical Insulation;2024-08

2. SiO2/Si3N4 Electret Incorporated AlN Substrates for Partial Discharge Mitigated WBG Power Electronics;2024 IEEE Transportation Electrification Conference and Expo (ITEC);2024-06-19

3. Mitigating High Electric Field Stresses in Power Modules Utilizing Field Grading Materials;2024 IEEE Electrical Insulation Conference (EIC);2024-06-02

4. Review of Hybrid Packaging Methods for Power Modules;Chinese Journal of Electrical Engineering;2023-12

5. A Cooling Method and Investigation on Process of Interconnection for High-temperature SiC Applications;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

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