Mitigating Partial Discharge Caused by Steep Voltage Pulses at High Temperatures
Author:
Affiliation:
1. Department of Electrical Engineering, University of Wisconsin--Milwaukee, Milwaukee, WI, USA
Funder
Office of Naval Research
DCN
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/94/10623348/10402020.pdf?arnumber=10402020
Reference35 articles.
1. The Current Status and Trends of 1,200-V Commercial Silicon-Carbide MOSFETs: Deep Physical Analysis of Power Transistors From a Designer’s Perspective
2. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
3. Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges
4. Review of Silicon Carbide Power Devices and Their Applications
5. Electret: An Entirely New Approach of Solving Partial Discharge Caused by Triple Points, Sharp Edges, Bubbles, and Airgaps
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1. Mitigating Space Charge Injection and Accumulation Using Electrets in Low Pressures;2024 IEEE Transportation Electrification Conference and Expo (ITEC);2024-06-19
2. Increasing Partial Discharge Inception Voltage at Low Pressures Using Electrets;2024 IEEE Transportation Electrification Conference and Expo (ITEC);2024-06-19
3. Mitigating Partial Discharge in Motor Winding Under Steep Voltage Pulses;2024 IEEE Transportation Electrification Conference and Expo (ITEC);2024-06-19
4. Preventing Space Charge Injection and Accumulation Using Electrets Under Steep Voltage Pulses with Varying Duty Cycle;2024 IEEE Electrical Insulation Conference (EIC);2024-06-02
5. Mitigating High Electric Field Stresses in Power Modules Utilizing Field Grading Materials;2024 IEEE Electrical Insulation Conference (EIC);2024-06-02
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