Demonstration of HfO2-Based Gate Dielectric With ~0.8-nm Equivalent Oxide Thickness on Si0.8Ge0.2 by Trimethylaluminum Pre-Treatment and Al Scavenger
Author:
Affiliation:
1. Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan
2. Taiwan Semiconductor Research Institute, Hsinchu, Taiwan
Funder
Ministry of Science and Technology, Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Biotechnology
Link
http://xplorestaging.ieee.org/ielx7/6245494/10049274/10109810.pdf?arnumber=10109810
Reference42 articles.
1. Enabling next generation CMOS by novel EOT scaling module;dong;Proc Symp VLSI Technol,2021
2. Oxygen vacancy enhanced room temperature magnetism in Al-doped MgO nanoparticles
3. Electrical Characteristics of Si0.8Ge0.2 p-MOSFET With TMA Pre-Doping and NH3 Plasma IL Treatment
4. Enhanced Performance in Al-Doped ZnO Based Transparent Flexible Transparent Thin-Film Transistors Due to Oxygen Vacancy in ZnO Film with Zn–Al–O Interfaces Fabricated by Atomic Layer Deposition
5. Reduction of MOS Interface Defects in TiN/Y₂O₃/Si₀.₇₈Ge₀.₂₂ Structures by Trimethylaluminum Treatment
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