The Endurance and Reliability Mechanisms Investigation of InGaZnO and InSnO Thin Film Transistors
Author:
Affiliation:
1. Key Laboratory of Fabrication Technologies for Integrated Circuits, Chinese Academy of Sciences, Beijing, China
2. Beijing Superstring Academy of Memory Technology, Beijing, China
Funder
National Key Research and Development Program of China
Scientific Instrument Developing Project of the Chinese Academy of Sciences
Strategic Priority Research Program of Chinese Academy of Sciences
Research Program of the Beijing Superstring Academy of Memory Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx8/6245494/10416702/10604821.pdf?arnumber=10604821
Reference25 articles.
1. Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors
2. High-mobility thin-film transistor with amorphous InGaZnO4 channel fabricated by room temperature rf-magnetron sputtering
3. Capacitor-less, Long-Retention (>400s) DRAM Cell Paving the Way towards Low-Power and High-Density Monolithic 3D DRAM
4. Tailoring IGZO-TFT architecture for capacitorless DRAM, demonstrating > 103s retention, >1011 cycles endurance and Lg scalability down to 14nm
5. Mechanism Analysis of Ultralow Leakage and Abnormal Instability in InGaZnO Thin-Film Transistor Toward DRAM
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