Design and implementation of a 3D-LSI image sensing processor

Author:

Kioi K.,Shinozaki T.,Toyoyama S.,Shirakawa K.,Ohtake K.,Tsuchimoto S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Fabrication of Back-Side Illuminated Complementary Metal Oxide Semiconductor Image Sensor Using Compliant Bump;Japanese Journal of Applied Physics;2010-04-20

2. Design of a 3-D fully depleted SOI computational RAM;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2005-03

3. 3D heterogeneous sensor system on a chip for defense and security applications;Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI;2004-09-01

4. SOI Circuits;Silicon-on-Insulator Technology: Materials to VLSI;2004

5. Semiconductor micropattern pixel detectors: a review of the beginnings;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2001-06

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