MIMO Design of 12x64 Element Polarization Sensitive SiGe Array for 3D In-line Detection of Defects at 220-260 GHz
Author:
Affiliation:
1. University of Siegen,High Frequency and Quantum Electronics,Germany
2. Fraunhofer Institute for Industrial Mathematics ITWM,Kaiserslautern,Germany
Funder
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9895463/9895465/09895822.pdf?arnumber=9895822
Reference4 articles.
1. Conception and realization of a semiconductor based 240 GHz full 3d MIMO imaging system;weisenstein;Terahertz RF Millimeter and Submillimeter-Wave Technology and Applications VII,2017
2. THz 3-D Image Formation Using SAR Techniques: Simulation, Processing and Experimental Results
3. 3D Inspection of Fiber-Reinforced Thermoplastics at THz frequencies
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1. A 223–276-GHz Cascadable FMCW Transceiver in 130-nm SiGe BiCMOS for Scalable MIMO Radar Arrays;IEEE Transactions on Microwave Theory and Techniques;2023-12
2. SiGe MIMO In-line Imager with 12x64 Elements for Real-time 3D Image Acquisition;2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz);2023-09-17
3. High-Power and High-Efficiency 1.3 THz Transmitter Using Discrete Schottky Diode Technology;2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz);2023-09-17
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