Conception and realization of a semiconductor based 240 GHz full 3D MIMO imaging system

Author:

Weisenstein Christian1,Kahl Matthias1,Friederich Fabian2,Haring Bolívar Peter1

Affiliation:

1. Univ. Siegen (Germany)

2. Fraunhofer-Institut für Physikalische Messtechnik (Germany)

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A 223–276-GHz Cascadable FMCW Transceiver in 130-nm SiGe BiCMOS for Scalable MIMO Radar Arrays;IEEE Transactions on Microwave Theory and Techniques;2023-12

2. Defect Detection in Bidirectional Glass Fabric Reinforced Thermoplastics Based on 3-D-THz Imaging;IEEE Transactions on Terahertz Science and Technology;2023-05

3. High-bandwidth FMCW THz Imaging in the 499-733 GHz Range for Defect Detection in Glass Fiber Reinforced Thermoplastics;2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz);2022-08-28

4. MIMO Design of 12x64 Element Polarization Sensitive SiGe Array for 3D In-line Detection of Defects at 220-260 GHz;2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz);2022-08-28

5. Terahertz Testing Technique for Fiber-Reinforced Composite Materials;Nondestructive Testing and Evaluation of Fiber-Reinforced Composite Structures;2022

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