Monitoring of FinFET Characteristics Using $\Delta V_{\text{DIBLSS}}/(I_{\text{on}}/I_{\text{off}})$ and $\Delta V_{\text{DIBL}}/(I_{\text{on}}/I

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Monitoring of FinFET Characteristics Using $\Delta V_{\text{DIBLSS}}/(I_{\text{on}}/I_{\text{off}})$ and $\Delta V_{\text{DIBL}}/(I_{\text{on}}/I_{\text{off}})$

Published:2019 Issue: Volume:7 Page:344-350
ISSN:2168-6734
Container-title:IEEE Journal of the Electron Devices Society
language:
Short-container-title:IEEE J. Electron Devices Soc.

Author:

Eng Yi-Chuen^ORCID,Wang Ted,Tseng Touber,Yang Chih-Wei^ORCID,Hsieh Chin-Yang,Hu Luke,Chang Tzu-Feng,Wang Chih-Yi,Hsu Steven,Cheng Osbert^ORCID,Lin Chien-Ting,Lin Yu-Shiang,Tsai Zen-Jay

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Biotechnology

Link

http://xplorestaging.ieee.org/ielx7/6245494/8656606/08640085.pdf?arnumber=8640085

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Significance of Overdrive Voltage in the Analysis or Short-Channel Behaviors of n-FinFET Devices;IEEE J ELECTRON DEVI;2022

2. Significance of Overdrive Voltage in the Analysis of Short-Channel Behaviors of n-FinFET Devices;IEEE Journal of the Electron Devices Society;2022

3. Pre-bond Qualification of Through-Silicon Via for the Application of 3-D Chip Stacking;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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