Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration

Author:

Kim Jinwoo,Krishna Chekuri Venkata Chaitanya,Rahman Nael Mizanur,Dolatsara Majid Ahadi,Torun Hakki,Swaminathan Madhavan,Mukhopadhyay Saibal,Kyu Lim Sung

Funder

DARPA CHIPS

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06

2. Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5D Heterogeneous Packages;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. A 0.458-pJ/bit 24-Gb/s/pin Capacitively Driven PAM-4 Transceiver With PAM-Based Crosstalk Cancellation for High-Density Die-to-Die Interfaces;IEEE Journal of Solid-State Circuits;2024

5. Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

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