Novel three-layer stacking process with face-to-back CoW 6 μm-pitch hybrid bonding-Reference-Cited by-同舟云学术

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Novel three-layer stacking process with face-to-back CoW 6 μm-pitch hybrid bonding

Published:2024-05-28 Issue: Volume: Page:56-61
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Urata Akihiro¹,Kamei Takahiro¹,Sakamoto Akihisa¹,Yoshioka Hirotaka¹,Hirano Takaaki¹,Shimizu Kan¹,Kagawa Yoshihisa¹,Iwamoto Hayato¹

Affiliation:

1. Sony Semiconductor Solutions Corporation,Kanagawa,Japan

Funder

New Energy and Industrial Technology Development Organization

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565180.pdf?arnumber=10565180

Reference8 articles.

1. Evolving Image Sensor Architecture through Stacking Devices

2. Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

3. Development of high reliability $6\ \mu\mathrm{m}$-pitch Cu-Cu connections using over-400mm²-large Chip on Wafer bonding process

4. Recent Advances and Trends in Cu–Cu Hybrid Bonding

5. Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration

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