Moving Towards Microchannel-based Chip Cooling
Author:
Affiliation:
1. SEMI,Milpitas,USA
2. KLA,Newport,UK
3. EV Group,Tempe,USA
4. Meta,Menlo Park,USA
5. TSMC,Hsinchu,Taiwan
6. HP Inc.,Corvallis,USA
7. Google,Mountain View,USA
8. ASE,Fremont,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565134.pdf?arnumber=10565134
Reference25 articles.
1. Recent Advances and Trends in Advanced Packaging
2. Gen 3 “Embedded” Cooling: Key Enabler for Energy Efficient Data Centers
3. Advanced System Integration for High Performance Computing with Liquid Cooling
4. Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
5. Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
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