High-Planarity, Ultra-Low-Temperature-Curable Photosensitive Polyimide for Heterogeneous Integration
Author:
Affiliation:
1. HD MicroSystems, Ltd.,Hitachi Site R&D Group,Hitachi,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565225.pdf?arnumber=10565225
Reference8 articles.
1. 2.5D MCM (Multi-chip Module) Technology Development for Advanced Package
2. Reliability study on high performance photo imageable dielectric for advanced package;Yoon
3. A study of failure mechanism in the formation of fine RDL patterns and Vias for heterogeneous packages in chip last fan-out panel level packaging
4. Low-temperature polyimide processing for next-gen backend applications;Karim;Chip scale review July-August 2021,2021
5. Low Temperature Curable Polyimide for Advanced Package
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