Low Temperature Curable Polyimide for Advanced Package-Reference-Cited by-同舟云学术

Low Temperature Curable Polyimide for Advanced Package

Published:2016 Issue:3 Volume:29 Page:379-382
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Sasaki Takahiro¹

Affiliation:

1. Asahi Kasei Corporation

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/29/3/29_379/_pdf

Reference4 articles.

1. 1. A. Mochizuki and M. Ueda, J. Photopolym. Sci. Technol., 4 (2001) 677.

2. 2. N. Anzai, Proc. IEEE Electronic Components Technology Conference (ECTC), 2014, p. 829.

3. 3. M. Fujita, IMAPS 2015 Orland-48th Annual International Symposium on Microelectronics, Oct.26-29, 2015, p. 505.

4. 4. N. Anzai, Proc. IEEE International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT-IAAC), Taipei, Taiwan, Oct. 22-25, 2013, p. 64.

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