Machine Learning for Deep Trench Bottom Width Measurements using Scatterometry : AM: Advanced Metrology-Reference-Cited by-同舟云学术

Machine Learning for Deep Trench Bottom Width Measurements using Scatterometry : AM: Advanced Metrology

Published:2023-05-01 Issue: Volume: Page:
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Container-title:2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Srichandan Sasmita¹,Heider Franz¹,Polak Yulia¹,Ehrentraut Georg¹,Juhasz Laszlo¹,Haberjahn Martin²,Sakalauskas Egidijus³,Haupt Ronny³

Affiliation:

1. Infineon Technologies Austria AG,Villach,Austria

2. Infineon Technologies Dresden GmbH & Co. KG,Dresden,Germany

3. Nova Measuring Instruments GmbH,Dresden,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10121052/10121025/10121130.pdf?arnumber=10121130

Reference5 articles.

1. Combination of Mass Metrology with Scatterometry to obtain bottom Width of deep Trenches : AM: Advanced Metrology

2. Advanced machine learning eco-system to address HVM optical metrology requirements

3. Ultra large pitch and depth structures metrology using spectral reflectometry in combination with RCWA based model and TLM Algorithm : AM: Advanced Metrology

4. Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines

5. Implementation of machine learning for high-volume manufacturing metrology challenges;timoney;Proc SPIE 10585 Metrology Inspection and Process Control for Microlithography XXXII,2018

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1. Optimization of Scatterometry Measurements by Enhancing with Machine Learning AM: Advanced Metrology;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology;Metrology, Inspection, and Process Control XXXVIII;2024-04-10