Monitoring Chip Branch Failure in Multichip IGBT Modules Based on Gate Charge-Reference-Cited by-同舟云学术

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Monitoring Chip Branch Failure in Multichip IGBT Modules Based on Gate Charge

Published:2023-05 Issue:5 Volume:70 Page:5214-5223
ISSN:0278-0046
Container-title:IEEE Transactions on Industrial Electronics
language:
Short-container-title:IEEE Trans. Ind. Electron.

Author:

Wang Kaihong¹^ORCID,Sun Pengju²^ORCID,Zhu Binxin³^ORCID,Luo Quanming²^ORCID,Du Xiong²^ORCID

Affiliation:

1. College of Electrical Engineering and New Energy, China Three Gorges University, Yichang, China

2. State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China

3. Hubei Provincial Key Laboratory on Operation and Control of Cascaded Hydropower Station, China Three Gorges University, Yichang, China

Funder

National Science Foundation of China for Distinguished Young Scholars

Natural Science Foundation of Hubei Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/41/10005867/09834154.pdf?arnumber=9834154

Reference40 articles.

1. Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems

2. Closed-Loop d${\bm i}/$d ${\bm t}$ and d ${\bm v}/$d${\bm t}$ IGBT Gate Driver

3. Selected failure mechanisms of modern power modules

4. Gate resistor-principles and applications rev-00, SEMIKRON,2007

5. Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter

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1. Fatigue Propagation Analysis of Crack Failure in High Power IGBT Solder Based on Multiphysics Coupling Model and XFEM;2024 IEEE 21st Biennial Conference on Electromagnetic Field Computation (CEFC);2024-06-02

2. In Situ Monitoring Chip Failure in Multichip IGBT Modules Using Turn-On Delay Time Extracted From Auxiliary Emitter Voltage;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-06

3. Condition Monitoring the Inhomogeneous Thermal Fatigue of Multi-chip IGBT Module Based on the Natural Frequency of Thermal Network;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

4. A Health Condition Indicator Localization Method for the Power Devices in Three-Phase Inverter;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-12

5. A high-reliability SEPIC converter with reconfigurable voltage conversion gain;Energy Reports;2023-09

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