On the Efficacy of Through-Silicon-Via Inductors-Reference-Cited by-同舟云学术

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On the Efficacy of Through-Silicon-Via Inductors

Published:2015-07 Issue:7 Volume:23 Page:1322-1334
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Tida Umamaheswara Rao,Yang Rongbo,Zhuo Cheng,Shi Yiyu

Funder

National Science Foundation CAREER

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/7131599/06872805.pdf?arnumber=6872805

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC;IEEE Access;2024

2. Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology;2023 IEEE 41st International Conference on Computer Design (ICCD);2023-11-06

3. Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-11

4. FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05

5. Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration;2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS);2023-08-06

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