Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies-Reference-Cited by-同舟云学术

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Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

Published:2011-04 Issue:4 Volume:19 Page:647-658
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Khan Nauman H.,Alam Syed M.,Hassoun Soha

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx5/92/5735629/05428771.pdf?arnumber=5428771

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3. Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC;IEEE Access;2024

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5. Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-11

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