Author:
Chao Chih-Hao,Chen Kun-Chih,Wu An-Yeu
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
12 articles.
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2. TCAR: Thermal and Congestion-Aware Routing Algorithm in a Partially Connected 3D Network on Chip;2022 12th International Conference on Computer and Knowledge Engineering (ICCKE);2022-11-17
3. Two-step thermal-aware routing algorithm in 3D NoC;2021 11th International Conference on Computer Engineering and Knowledge (ICCKE);2021-10-28
4. SSS;ACM Journal on Emerging Technologies in Computing Systems;2019-07-31
5. Thermal-aware network-on-chips: Single- and cross-layered approaches;Future Generation Computer Systems;2019-02