Funder
Key-Area Research and Development Program of Guangdong Province
National Natural Science Foundation of China
Key Science and Technology Program of Shaanxi Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
11 articles.
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1. Layout Optimization of Integrated Inductors and Capacitors Using TGV Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024
2. Silicon-Based Integrated RF Filter with 3D Coupled Pole Based on Through-Silicon Via Technology;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13
3. A Reusable Interposer for Multi-Chiplet Microsystems Reconfiguration;2023 IEEE MTT-S International Wireless Symposium (IWS);2023-05-14
4. A Compact Three-dimensional Wilkinson Power Divider Based on TSV;2023 6th International Conference on Electronics Technology (ICET);2023-05-12
5. SIW Bandpass Filter With Wide Stopband Using Harmonic Interleaving and Orthogonal Transmission Techniques;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-11