Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting-Reference-Cited by-同舟云学术

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Packaging for power semiconductors based on the 3D printing technology Selective Laser Melting

Published:2014-08 Issue: Volume: Page:
ISSN:
Container-title:2014 16th European Conference on Power Electronics and Applications
language:
Short-container-title:

Author:

Conrad Marcus¹,De Doncker Rik W.¹,Schniedenharn Maximilian²,Diatlov Andrei²

Affiliation:

1. ISEA, RWTH Aachen University, Jägerstr. 17-19, 52066, Germany

2. Fraunhofer ILT, Steinbachstr. 15, 52074 Aachen, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6898115/6910682/06910965.pdf?arnumber=6910965

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications;Engineering;2023-07

3. Ultra-Compact Design of Additively Manufactured Variable Cross Section Profile Bar Winding for Traction Motor;2023 IEEE International Electric Machines & Drives Conference (IEMDC);2023-05-15

4. A Review on Additive Manufacturing Possibilities for Electrical Machines;Energies;2021-03-31

5. Multimodal information fusion based on LSTM for 3D model retrieval;Multimedia Tools and Applications;2020-04-11

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