Methodology for Coupling and Interference Prediction in Integrated-Circuit Substrates-Reference-Cited by-同舟云学术

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Methodology for Coupling and Interference Prediction in Integrated-Circuit Substrates

Published:2016-08 Issue:4 Volume:58 Page:1118-1127
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Grau Novellas Merce,Serra Ramiro,Rose Matthias

Funder

STW-HTSM Program of The Netherlands

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/15/7524058/07442105.pdf?arnumber=7442105

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Joint Channel Allocation and Power Control for Uplink NOMA-Assisted Multi-UAV Networks;Wireless Communications and Mobile Computing;2021-12-29

2. On-Chip Interference Generation Mechanisms From an Electromagnetic Perspective;IEEE Transactions on Electromagnetic Compatibility;2018-12

3. Delay-Constrained Routing Based on Stochastic Model for Flying Ad Hoc Networks;Mobile Information Systems;2018-08-13

4. Efficient Modeling of Multistage Integrated Circuit Passive Isolation Structures;IEEE Transactions on Electromagnetic Compatibility;2018-04

5. Fast Electromagnetic Characterization of Integrated Circuit Passive Isolation Structures Based on Interference Blocking;IEEE Transactions on Microwave Theory and Techniques;2017-11

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