Estimation of Power Switching Current by Chip-Package-PCB Cosimulation-Reference-Cited by-同舟云学术

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Estimation of Power Switching Current by Chip-Package-PCB Cosimulation

Published:2010-05 Issue:2 Volume:52 Page:311-319
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Park Hyun Ho,Song Seung-Hyun,Han Sang-Tae,Jang Tae-Sun,Jung Jin-Hwan,Park Hark-Byeong

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx5/15/5466499/05462837.pdf?arnumber=5462837

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Parametric Conducted Emission Modeling Method of a Switching Model Power Supply (SMPS) Chip by a Developed Vector Fitting Algorithm;Electronics;2019-06-26

2. Power Delivery Network and Integrity in 3D ‐ IC Chips;Handbook of 3D Integration;2019-02-08

3. A New Methodology to Build the Internal Activity Block of ICEM-CE for Complex Integrated Circuits;IEEE Transactions on Electromagnetic Compatibility;2018-10

4. Electromagnetic Noises;VLSI Design and Test for Systems Dependability;2018-07-21

5. Novel Extraction Method for Unknown Chip PDN Using De-Embedding Technique;The Journal of Korean Institute of Electromagnetic Engineering and Science;2013-06-30

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