A 57.6 Gb/s Wireless Link based on 26.4 dBm EIRP D-band Transmitter Module and a Channel Bonding Chipset on CMOS 45nm-Reference-Cited by-同舟云学术

A 57.6 Gb/s Wireless Link based on 26.4 dBm EIRP D-band Transmitter Module and a Channel Bonding Chipset on CMOS 45nm

Published:2023-06-11 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
language:
Short-container-title:

Author:

Gonzalez-Jimenez Jose Luis¹,Siligaris Alexandre¹,Hamani Abdelaziz¹,Foglia-Manzillo Francesco¹,Courouve Pierre¹,Cassiau Nicolas¹,Dehos Cedric¹,Clemente Antonio¹

Affiliation:

1. Université de Grenoble-Alpes,CEA-Leti,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10186107/10186112/10186148.pdf?arnumber=10186148

Reference10 articles.

1. A D-Band High-Gain Antenna Module Combining an In-Package Active Feed and a Flat Discrete Lens

2. A Multichannel Programmable High Order Frequency Multiplier for Channel Bonding and Full Duplex Transceivers at 60 GHz Band

3. Analysis and Design of Cost-Effective, High-Throughput LDPC Decoders

4. Fully Integrated 2D Scalable TX/RX Chipset for D-Band Phased-Array-on-Glass Modules

5. A Fully Packaged 135-GHz Multiuser MIMO Transmitter Array Tile for Wireless Communications

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A 110-to-170-GHz OOK Transmitter with 40-Gb/s Data Rate and 40-dB On-Off Ratio in 28-nm CMOS;2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC);2024-06-16

2. A 56Gb/s Zero-IF D-Band Transmitter for a Beamformer in 22nm FD-SOI;2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC);2024-06-16

3. An Energy-Efficient 56-Gb/s D-Band TX-to-RX Link Using CMOS ICs and Transmitarray Antennas;IEEE Microwave and Wireless Technology Letters;2024-06

4. Characterization of a D-Band Active Transmitarray System for Efficient Point-to-Point Links;2024 18th European Conference on Antennas and Propagation (EuCAP);2024-03-17

5. A D-Band Two-Way Differential Power Divider on 65-nm CMOS Process;IEEE Microwave and Wireless Technology Letters;2024-03