Fully Integrated 2D Scalable TX/RX Chipset for D-Band Phased-Array-on-Glass Modules
Author:
Affiliation:
1. Nokia Bell Labs,New Providence,NJ
2. L3 Harris,Queensland,Australia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9731529/9731102/09731626.pdf?arnumber=9731626
Reference6 articles.
1. An Eight-Element 140-GHz Wafer-Scale IF Beamforming Phased-Array Receiver With 64-QAM Operation in CMOS RFSOI;li;IEEE JSSC,2021
2. An Eight-Element 140 GHz Wafer-Scale Phased-Array Transmitter with 32 dBm Peak EIRP and > 16 Gbps 16QAM and 64QAM Operation
3. Full D-Band Transmit–Receive Module for Phased Array Systems in 130-nm SiGe BiCMOS
4. A Packaged 135GHz 22nm FD-SOI Transmitter on an LTCC Carrier
5. D-band Phased-Array TX and RX Front Ends Utilizing Radio-on-Glass Technology
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3. Glass interposer for heterogeneous integration of flip-chipped photonic and electronic integrated circuits;Applied Physics Letters;2024-07-29
4. A 300-GHz-Band 40-Gb/s 2D Phased-Array CMOS Transmitter with Near-Half-Wave Antenna Pitch;2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC);2024-06-16
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