Author:
Malainou Antonia,Visker Jakob,Tezcan Deniz Sabuncuoglu
Cited by
1 articles.
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1. Wafer-level Sn-Ag-Cu/SiO2 Transient Liquid Phase Hybrid Bonding (TLP-HB) Technology;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08