Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading-Reference-Cited by-同舟云学术

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Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Author:

Meier K.¹,Leslie D.²,Dasgupta A.²,Roellig M.³,Bock K.¹

Affiliation:

1. Technische Universität Dresden, Institute of Electronic Packaging Technology,Dresden,Germany,D-01062

2. University of Maryland, Center for Advanced Life Cycle Engineering (CALCE),MD,USA

3. Fraunhofer Institute of Ceramic Technologies and Systems,Branch Materials Diagnostics,Dresden,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026642.pdf?arnumber=9026642

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical Behavior of Thin Die Assembly on Flexible Substrate Under Vibration Testing;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

3. Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

5. Failure patterns of solder joints identified through lifetime vibration tests;Nondestructive Testing and Evaluation;2022-06-13

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