Materials selection issues for high operating temperature (HOT) electronic packaging-Reference-Cited by-同舟云学术

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Materials selection issues for high operating temperature (HOT) electronic packaging

Published: Issue: Volume: Page:
ISSN:
Container-title:1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)
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Author:

Gallagher C.,Shearer B.,Matijasevic G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5911/15764/00730695.pdf?arnumber=730695

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Co-growing design of super-repellent dual-layer coating for multiple heat dissipation improvement;Chemical Engineering Journal;2022-01

4. Air cooled heat sink geometries subjected to forced flow: A critical review;International Journal of Heat and Mass Transfer;2019-03

5. High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds;Metallurgical and Materials Transactions A;2015-07-28

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