Author:
Koleňák Roman, ,Kostolný Igor
Publisher
American Institute of Mathematical Sciences (AIMS)
Reference18 articles.
1. High-temperature lead-free solder alternatives;Chidambaram V, Hattel J, Hald J;Microelectron Eng
2. Improving the reliability of Si die attachment with Zn–Sn-based high-temperature Pb-free solder using a TiN diffusion barrier;Kim S, Kim KS, Kim SS, et al.;J Electron Mater
3. High-tepmerature lead-free solders: Properties and possibilities
4. Power device packaging technologies for extreme environments;Johnson RW, Wang C, Liu Y, et al.;IEEE T Electron Pack
5. Effect of Au–Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints;Liu W, An R, Wang CQ, et al.;Solder Surf Mt Tech
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献