Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

Abstract

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.