INTERMETALLIC COMPOUND FORMATION IN Ni/Sn DIFFUSION COUPLE AT ATMOSPHERIC AND AT 10−8 ATMOSPHERE PRESSURE
Author:
Affiliation:
1. LESIMS, Department of Physics, Badji Mokhtar Annaba University, Annada 23000, Algeria
2. Department of Physics, College of Science, University of Bahrain, P. O. Box 32038, Kingdom of Bahrain
Abstract
Publisher
World Scientific Pub Co Pte Lt
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
https://www.worldscientific.com/doi/pdf/10.1142/S0218625X18500233
Reference41 articles.
1. Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process
2. Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
3. Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433 K
4. Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures
5. Room temperature interfacial reactions in electrodeposited Au/Sn couples
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