Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process-Reference-Cited by-同舟云学术

Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Published:2017-05 Issue: Volume:36 Page:420-426
ISSN:1350-4177
Container-title:Ultrasonics Sonochemistry
language:en
Short-container-title:Ultrasonics Sonochemistry

Author:

Li Z.L.,Dong H.J.,Song X.G.,Zhao H.Y.,Feng J.C.,Liu J.H.,Tian H.,Wang S.J.

Funder

Shandong Provincial Natural Science Foundation of China

National Natural Science Foundation of China

Shanghai Aerospace Innovation Fund

National Science and Technology Major Project

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology, Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference38 articles.

1. State of the art of high temperature power electronics;Buttay;Mater. Sci. Eng. B,2011

2. Evaluation of encapsulation materials for high-temperature power device packaging;Locatelli;IEEE Trans. Power Electron.,2014

3. Power conversion with sic devices at extremely high ambient temperatures;Funaki;IEEE Trans. Power Electron.,2007

4. Silicon carbide power module for high-temperature applications;Palmer;IEEE Trans. Compon. Packag. Manuf. Technol.,2012

5. A high-temperature sic three-phase AC-DC converter design for >100°C ambient temperature;Wang;IEEE Trans. Power Electron.,2013

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