SELECTIVE DRY ETCHING OF GaN OVER AlGaN IN BCL3/SF6 MIXTURES

Author:

BUTTARI D.1,CHINI A.1,CHAKRABORTY A.1,MCCARTHY L.1,XING H.1,PALACIOS T.1,SHEN L.1,KELLER S.1,MISHRA U. K.1

Affiliation:

1. Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, California 93106, U.S.A.

Abstract

Inductively coupled plasma (ICP) etching of GaN with high selectivity over Al .22 Ga .78 N in BCl 3/ SF 6 mixtures has been studied. Selectivity and surface morphology were investigated over a wide range of pressures (3.75–37.5mTorr), RF powers (30–120 W), ICP powers (100–400 W), and SF 6/ BCl 3 ratios (0.1–0.7). Higher pressures, lower dc biases, and higher SF 6/ BCl 3 ratios increased the GaN to AlGaN selectivity. Selectivities up to 25 were measured by laser interferometry. A root mean square (rms) surface roughness of 0.67 nm was measured by atomic force microscopy (AFM) after removal of 0.5 μm from a GaN template (process selectivity: 15, as-grown rms surface roughness: 0.56 nm). A degradation in surface morphology, with the gradual formation of pits, was observed for selectivities above 10.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electronic, Optical and Magnetic Materials

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