Inner-Gate-Engineered GAA MOSFET to Enhance the Electrostatic Integrity

Author:

Jena Biswajit1,Dash Sidhartha2,Routray Soumya Ranjan3,Mishra Guru Prasad4ORCID

Affiliation:

1. Department of Electronics and Communication Engineering, Koneru Lakshmaiah Education Foundation (K L Deemed to be University), Vaddeswaram, Guntur 522502 Andhra Pradesh, India

2. Department of Electronics and Communication Engineering, Institute of Technical Education and Research, Siksha ‘O’ Anusandhan Deemed to be University, Khandagiri, Bhubaneswar 751030, Odisha, India

3. Department of Electronics and Communication Engineering, SRM Institute of Science and Technology, Kattankulathur, Chennai 603203, Tamil Nadu, India

4. Department of Electronics and Communication Engineering, National Institute of Technology Raipur, Raipur 492010, Chattisgarh, India

Abstract

Gate-all-around (GAA) MOSFETs are the best multi-gate MOSFET structure due to their strong electrostatic control over the channel. The electrostatic controllability can be enhanced further by applying some gate engineering technique to the existing GAA structure. This paper investigates the effect of inner gate (core gate) on the electrostatic performance of conventional GAA MOSFET. The inner gate engineering increases both the electrostatic control and packing density of GAA MOSFET. In this paper, we have presented an inner-gate-engineered (IGE) GAA MOSFET and inspected its advantages over conventional counterparts. The proposed structure exhibits higher [Formula: see text] ratio, low threshold voltage and improved RF performances as compared to the conventional structure. Analytic simulation has been carried out for numerous figures of merit (FOMs) for different technology nodes.

Publisher

World Scientific Pub Co Pte Lt

Subject

Condensed Matter Physics,General Materials Science

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