A MULTI-STAGE FAULT-TOLERANT MULTIPLIER WITH TRIPLE MODULE REDUNDANCY (TMR) TECHNIQUE

Author:

CHEN YUAN-HO1,LU CHIH-WEN2,SHYU SHIAN-SHING3,LEE CHUNG-LIN3,OU TING-CHIA3

Affiliation:

1. Department of Information and Computer Engineering, Chung Yuan Christian University, Taoyuan 320, Taiwan

2. Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan

3. Institute of Nuclear Energy Research, Atomic Energy Council, Taiwan

Abstract

In this study, a multistage fault-tolerant (MSFT) scheme for two fixed-width array multipliers is proposed. To tolerate the fault that occurs in an integrated circuit, an architecture by using three redundant triple module redundancy (TMR) processing elements (PEs) (TMR-PE) is proposed. The proposed Type-I MSFT multipliers divide the array multiplier into multiple stages, and implement a single PE by considering multiple computation cycles to achieve a low area design. Thus, the MSFT multiplier employs the TMR-PEs to achieve a low-cost fault-tolerant design. The TMR-PEs were designed using compressors with multiple operands, such as 4-2 compressors or other compressors with additional operands, to reduce the number of computation cycles and expedite the execution process. To improve the fault-correction capability, Type-II MSFT multipliers that follow the multistage structure, which was designed as a TMR technique, were proposed. Because of implementation using a 0.18-μm CMOS process, the long word-length MSFT multiplier saves a substantial amount of the circuit area. The proposed 64 × 64 Type-I MSFT multiplier has only 13% of the circuit area and 3% of the delay overhead of the original multiplier. Based on the measurements of the area-delay product (AT) metric, the value of the 64 × 64 Type-I MSFT multiplier is only 0.21-fold of the value of the original multiplier. Regarding the fault-correction capability, the 64 × 64 Type-II MSFT multiplier achieves an area-delay-fault efficiency (ATF) that is 11-fold of the value of the original TMR multiplier.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

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