A LOW POWER HIGH RESOLUTION ROIC DESIGN WITH 14-BIT COLUMN-LEVEL ADC FOR 384 × 288 IRFPA

Author:

ZHANG YAJING1,LU WENGAO1,WANG GUANNAN1,CHEN ZHONGJIAN1,ZHANG YACONG1

Affiliation:

1. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Microelectronics, Peking University, Beijing 100871, China

Abstract

A readout integrated circuit (ROIC) of infrared focal plane array (IRFPA) with low power and low noise is presented in this paper. It consists of a 384 × 288 pixel array and column-level A/D conversion circuits. The proposed system has high resolution because of the odd–even Analog to Digital Conversion (ADC) structure, containing correlated switches design, multi-Vth amplifier design and high speed high resolution comparator design including latch-stage. Designed and simulated in 0.35-μm CMOS process, this high performance ROIC achieves 81.24 dB SNR at 8.64 KS/s consuming 98 mW under 5 V voltage supply, resulting in an ENOB of 13.2-bit.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

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