Application of Various Electromagnetic Coupling Modes for the Better MHD Flow Distribution and Thermal Management Within a Liquid Metal Manifold

Abstract

In this work, 12 different electromagnetic coupling modes are considered by assuming the side walls and Hartmann walls of supply channel, expansion channel and three sub-channels of a liquid metal manifold to be electrically conducting or electrically insulating separately. The main purpose of this study is to identify the best mode from the viewpoint of uniform distributions of the flow and heat transfer through the manifold. To prevent the heat augmentation through the manifold sub-channels, it is highly necessary to have a uniform velocity distribution therein. Numerical results demonstrate that the electromagnetic coupling mode in which all Hartmann walls and all side walls of the manifold are electrically conducting has the best flow distribution within the manifold and consequently it exhibits a uniform thermal distribution through the manifold without any significant heat load. It is also found that the smallest pressure drop and therefore the lowest required power to pump the liquid metal across the manifold is devoted to the mode in which only Hartmann walls of the expansion channel are electrically conducting.