Effects of Pre-Existing Defects on Nanoimprint Process Investigated by Molecular Dynamics Simulation
Author:
Affiliation:
1. Center for Precision Engineering, Harbin Institute of Technology, Harbin, P. R. China
2. Center of Ultra-Precision Optoelectronic Engineering, Harbin Institute of Technology, Harbin, P. R. China
Abstract
Publisher
World Scientific Pub Co Pte Lt
Subject
Electrical and Electronic Engineering,Computer Science Applications,Condensed Matter Physics,General Materials Science,Bioengineering,Biotechnology
Link
https://www.worldscientific.com/doi/pdf/10.1142/S0219581X14600205
Reference10 articles.
1. Studies on nanoimprint process parameters of copper by molecular dynamics analysis
2. Atomic-Scale Friction in Direct Imprinting Process: Molecular Dynamics Simulation
3. Effects of mold shape and sidewall roughness on nanoimprint by molecular dynamics simulation
4. The sintering and densification behaviour of many copper nanoparticles: A molecular dynamics study
5. Effect of water separation layer on metal nanoforming process investigated using molecular dynamics simulations
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