The sintering and densification behaviour of many copper nanoparticles: A molecular dynamics study-Reference-Cited by-同舟云学术

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The sintering and densification behaviour of many copper nanoparticles: A molecular dynamics study

Published:2013-06 Issue: Volume:74 Page:1-11
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Cheng Bingqing,Ngan Alfonso H.W.

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference30 articles.

1. Mechanical behavior of nanocrystalline Cu and Pd

2. Residual stress, strain and faults in nanocrystalline palladium and copper

3. Rate-controlled sintering of ultrafine nickel powder

4. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

5. Spark plasma sintering synthesis of porous nanocrystalline titanium alloys for biomedical applications

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