A New Inverse Analysis Method for Identifying the Elastic Properties of Thin Films Considering Thickness and Substrate Effects Simultaneously

Abstract

This paper presents an innovative methodology for the measurement of the mechanical properties of thin films. The purpose is to identify the elastic properties of thin film materials considering the effects of thickness and substrate simultaneously. The new approach is based on the Dimensional Analysis Method (DAM) and the Finite Element Method (FEM) to develop the model’s explicit form. Using the reverse analysis method, numerical indentation tests were carried out to obtain the Young’s modulus of the film. Therefore, the identified film modulus was completely consistent with the input modulus, which ensures the reliability and the effectiveness of the proposed method. Moreover, a case study of TiN nanocoating deposited on Zr-Based Metallic Glasses was considered to validate the proposed model. This model is useful for thin film materials and can be used in different technological applications.